JPS61195082U - - Google Patents
Info
- Publication number
- JPS61195082U JPS61195082U JP8068285U JP8068285U JPS61195082U JP S61195082 U JPS61195082 U JP S61195082U JP 8068285 U JP8068285 U JP 8068285U JP 8068285 U JP8068285 U JP 8068285U JP S61195082 U JPS61195082 U JP S61195082U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- board
- diameter
- clamping claws
- lead wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 5
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068285U JPS61195082U (en]) | 1985-05-28 | 1985-05-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8068285U JPS61195082U (en]) | 1985-05-28 | 1985-05-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS61195082U true JPS61195082U (en]) | 1986-12-04 |
Family
ID=30626765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8068285U Pending JPS61195082U (en]) | 1985-05-28 | 1985-05-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS61195082U (en]) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480835A (zh) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | 焊接连接销、半导体封装基板以及使用它们安装半导体芯片的方法 |
-
1985
- 1985-05-28 JP JP8068285U patent/JPS61195082U/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102480835A (zh) * | 2010-11-24 | 2012-05-30 | 三星电机株式会社 | 焊接连接销、半导体封装基板以及使用它们安装半导体芯片的方法 |
| KR20120056128A (ko) * | 2010-11-24 | 2012-06-01 | 삼성전기주식회사 | 솔더링 연결핀, 상기 솔더링 연결핀을 이용한 반도체 패키지 기판 및 반도체칩의 실장방법 |
| JP2012114394A (ja) * | 2010-11-24 | 2012-06-14 | Samsung Electro-Mechanics Co Ltd | 半田付け連結ピン、前記半田付け連結ピンを利用した半導体パッケージ基板及び半導体チップの実装方法 |